All Courses

IPC-A-610 Certified IPC Trainer Course Topics:

• Establishing and maintaining integrity of the certification program
• Purpose and application of IPC-A-610
• Hardware installation
• Soldering criteria, including lead free connections
• Soldered requirements for connecting to terminals
• Soldered connection requirements for plated-through holes
• Surface mounting criteria for chip components, leadless and leaded chip carriers
• Swaged hardware, and heatsink requirements of mechanical assemblies
• Component mounting criteria for DIPS, socket pins, and card edge connectors
• Jumper wire assembly requirements
• Solder fillet dimensional criteria for all major SMT component groups
• Soldering anomalies such as tombstoning, dewetting, voiding, etc
• Criteria for component damage, laminate conditions, cleaning and coating
• Steps to effectively using the lesson plan and materials, tips on inspection and a review of important Certified IPC Trainer skills

IPC-A-610 Certified IPC Trainer Course Topics:

• Establishing and maintaining integrity of the certification program
• Purpose and application of IPC-A-610
• Hardware installation
• Soldering criteria, including lead free connections
• Soldered requirements for connecting to terminals
• Soldered connection requirements for plated-through holes
• Surface mounting criteria for chip components, leadless and leaded chip carriers
• Swaged hardware, and heatsink requirements of mechanical assemblies
• Component mounting criteria for DIPS, socket pins, and card edge connectors
• Jumper wire assembly requirements
• Solder fillet dimensional criteria for all major SMT component groups
• Soldering anomalies such as tombstoning, dewetting, voiding, etc
• Criteria for component damage, laminate conditions, cleaning and coating
• Steps to effectively using the lesson plan and materials, tips on inspection and a review of important Certified IPC Trainer skills

The IPC-A-620 Training and Certification course is conducted over three days and includes the following topics:

• Cable and wire dimensioning, tolerances and preparation
• Crimp terminations: - Stamped and formed contacts - Machined contacts
• Insulation displacement connections
• Ultrasonic welding
• Soldered terminations
• Splices
• Connectorisation
• Moulding and potting
• Marking and labelling
• Co-axial and twin-axial assembly
• Wire bundle securing
• Shielding
• Installation
• Testing of Cable/Wire Harness Assemblies

The IPC-A-620 Training and Certification course is conducted over three days and includes the following topics:

• Cable and wire dimensioning, tolerances and preparation
• Crimp terminations: - Stamped and formed contacts - Machined contacts
• Insulation displacement connections
• Ultrasonic welding
• Soldered terminations
• Splices
• Connectorisation
• Moulding and potting
• Marking and labelling
• Co-axial and twin-axial assembly
• Wire bundle securing
• Shielding
• Installation
• Testing of Cable/Wire Harness Assemblies

The Combined IPC-A-610 and IPC-A-620 Training and Certification course is conducted over five days and includes the following topics:

IPC-A-610 Certified IPC Trainer Course Topics:

• Establishing and maintaining integrity of the certification program
• Purpose and application of IPC-A-610
• Hardware installation
• Soldering criteria, including lead free connections
• Soldered requirements for connecting to terminals
• Soldered connection requirements for plated-through holes
• Surface mounting criteria for chip components, leadless and leaded chip carriers
• Swaged hardware, and heatsink requirements of mechanical assemblies
• Component mounting criteria for DIPS, socket pins, and card edge connectors
• Jumper wire assembly requirements
• Solder fillet dimensional criteria for all major SMT component groups
• Soldering anomalies such as tombstoning, dewetting, voiding, etc
• Criteria for component damage, laminate conditions, cleaning and coating
• Steps to effectively using the lesson plan and materials, tips on inspection and a review of important Certified IPC Trainer skills

IPC-A-620 Training and Certification Course Topics:

• Cable and wire dimensioning, tolerances and preparation
• Crimp terminations: - Stamped and formed contacts - Machined contacts
• Insulation displacement connections
• Ultrasonic welding
• Soldered terminations
• Splices
• Connectorisation
• Moulding and potting
• Marking and labelling
• Co-axial and twin-axial assembly
• Wire bundle securing
• Shielding
• Installation
• Testing of Cable/Wire Harness Assemblies

Companies participating in IPC's Rework, Repair and Modification Training and Certification Program send candidates to Approved IPC-7711/7721 Training Centers for forty hours of intensive, hands-on instruction. Candidates who pass the classroom exam and skills demonstrations are recognised by IPC as 7711/21 Certified IPC Trainers and leave with a lesson plan, visuals and materials for training Application Specialists (operators) classified as Certified IPC Specialists (CIS) on up to nine different assembly rework and repair modules. Certified IPC Trainers are certified for two years.

Companies participating in IPC's Rework, Repair and Modification Training and Certification Program send candidates to Approved IPC-7711/7721 Training Centers for forty hours of intensive, hands-on instruction. Candidates who pass the classroom exam and skills demonstrations are recognised by IPC as 7711/21 Certified IPC Trainers and leave with a lesson plan, visuals and materials for training Application Specialists (operators) classified as Certified IPC Specialists (CIS) on up to nine different assembly rework and repair modules. Certified IPC Trainers are certified for two years.

The J-STD-001 “Requirements for Soldered Electrical and Electronic Assemblies” has emerged as the preeminent authority for electronics assembly manufacturing. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry-consensus requirements for a broad range of electronic products.

The J-STD-001 “Requirements for Soldered Electrical and Electronic Assemblies” has emerged as the preeminent authority for electronics assembly manufacturing. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry-consensus requirements for a broad range of electronic products.

The J-STD-001 “Requirements for Soldered Electrical and Electronic Assemblies” has emerged as the preeminent authority for electronics assembly manufacturing. The standard describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry-consensus requirements for a broad range of electronic products.