IPC-A-610
The Combined IPC-A-610 and IPC-A-620 Training and Certification course is conducted over five days and includes the following topics:
IPC-A-610 Certified IPC Trainer Course Topics:
- Establishing and maintaining integrity of the certification program
- Purpose and application of IPC-A-610
- Hardware installation
- Soldering criteria, including lead free connections
- Soldered requirements for connecting to terminals
- Soldered connection requirements for plated-through holes
- Surface mounting criteria for chip components, leadless and leaded chip carriers
- Swaged hardware, and heatsink requirements of mechanical assemblies
- Component mounting criteria for DIPS, socket pins, and card edge connectors
- Jumper wire assembly requirements
- Solder fillet dimensional criteria for all major SMT component groups
- Soldering anomalies such as tombstoning, dewetting, voiding, etc
- Criteria for component damage, laminate conditions, cleaning and coating
- Steps to effectively using the lesson plan and materials, tips on inspection and a review of important Certified IPC Trainer skills
IPC-A-620 Training and Certification Course Topics:
- Cable and wire dimensioning, tolerances and preparation
- Crimp terminations: - Stamped and formed contacts - Machined contacts
- Insulation displacement connections
- Ultrasonic welding
- Soldered terminations
- Splices
- Connectorisation
- Moulding and potting
- Marking and labelling
- Co-axial and twin-axial assembly
- Wire bundle securing
- Shielding
- Installation
- Testing of Cable/Wire Harness Assemblies
Event Date | 14 Oct 2024 8:45 am |
Event End Date | 18 Oct 2024 4:30 pm |
Cut Off Date | 11 Oct 2024 |
Capacity | 10 |
Individual Price | $2,720.00 |
Location | Training Centre Adelaide |
Categories | IPC-A-610, IPC/WHMA-A-620 |
IPC-A-610 Training Course Information
The IPC-A-620 Training and Certification course is conducted over three days and includes the following topics:
- Purpose and application of IPC-A-610
- Hardware installation
- Soldering criteria, including lead free connections
- Soldered requirements for connecting to terminals
- Soldered connection requirements for plated-through holes
- Surface mounting criteria for chip components, leadless and leaded chip carriers
- Swaged hardware, and heatsink requirements of mechanical assemblies
- Component mounting criteria for DIPS, socket pins, and card edge connectors
- Jumper wire assembly requirements
- Solder fillet dimensional criteria for all major SMT component groups
- Soldering anomalies such as tombstoning, dewetting, voiding, etc
- Criteria for component damage, laminate conditions, cleaning and coating