IPC-A-610
IPC-A-610, Acceptability of Electronic Assemblies, is the most widely used specification published by IPC with an international reputation as THE source for end-product acceptance criteria in both consumer and high-reliability electronic assemblies. A comprehensive and technical program, this certification will improve candidates’ accuracy of ‘discrimination’ between an ‘acceptable’ and ‘non-conforming’ electronic assembly per the IPC-A-610 standard, leading to continuous improvement in product quality and reliability.
| Event Date | 25 Jun 2025 8:45 am |
| Event End Date | 27 Jun 2025 4:30 pm |
| Cut Off Date | 20 Jun 2025 |
| Capacity | 8 |
| Individual Price | $1,670.00 |
| Location | Training Centre Adelaide |
| Categories | IPC-A-610 |
IPC-A-610, Acceptability of Electronic Assemblies, is the most widely used specification published by IPC with an international reputation as THE source for end-product acceptance criteria in both consumer and high-reliability electronic assemblies. A comprehensive and technical program, this certification will improve candidates’ accuracy of ‘discrimination’ between an ‘acceptable’ and ‘non-conforming’ electronic assembly per the IPC-A-610 standard, leading to continuous improvement in product quality and reliability.
| Event Date | 06 Aug 2025 8:45 am |
| Event End Date | 08 Aug 2025 4:30 pm |
| Cut Off Date | 01 Aug 2025 |
| Capacity | 8 |
| Individual Price | $1,670.00 |
| Location | Training Centre Adelaide |
| Categories | IPC-A-610 |
IPC-A-610 Training Course Information
The IPC-A-620 Training and Certification course is conducted over three days and includes the following topics:
- Purpose and application of IPC-A-610
- Hardware installation
- Soldering criteria, including lead free connections
- Soldered requirements for connecting to terminals
- Soldered connection requirements for plated-through holes
- Surface mounting criteria for chip components, leadless and leaded chip carriers
- Swaged hardware, and heatsink requirements of mechanical assemblies
- Component mounting criteria for DIPS, socket pins, and card edge connectors
- Jumper wire assembly requirements
- Solder fillet dimensional criteria for all major SMT component groups
- Soldering anomalies such as tombstoning, dewetting, voiding, etc
- Criteria for component damage, laminate conditions, cleaning and coating
IPC Training and Publications
The SMCBA is a Licenced IPC Training Centre for the IPC programs -
J-STD-001, IPC-A-610, IPC/WHMA-A-620, IPC-7711/21
