IPC-A-610 Recertification (CIS) 23-JAN-2025

 THIS RECERTIFICATION COURSE IS INTENDED FOR INDIVIDUALS WITH A CURRENT CERTIFICATION

*To recertify, you must be within the 6-month recertification window (6 months prior to expiry of current certificate) as per the IPC Policies and Procedures. See here: Certifications in Electronics Manufacturing | IPC International

*Please include your current IPC Certificate Number in your booking.

TOPICS COVERED IN THE IPC-A-610 CERTIFICATION COURSE (REVISION J):

Module 1 (Required)
General, Applicable Documents and Handling

Module 2 (Optional)
Soldering and High Voltage

Module 3 (Optional)
Component Damage & Printed Boards and Assemblies

Module 4* (Optional)
Terminal Connections

Module 5** (Optional)
Through-Hole Technology and Jumper Wires

Module 6** (Optional)
Surface Mount Assemblies and Jumper Wires

Module 7 (Optional)
Hardware

*Module 4 requires the completion of Module 2 first
** Modules 5 and 6 Require the completion of Modules 2 & 3 first

 

FEES:

IPC-A-610 Recertification Course Fee: Book online or contact the SMCBA for pricing.
SMCBA Members receive a discount.

PLEASE NOTE:

The fee for the IPC-A-610 Recertification course includes all materials for the course, refreshments and catering each day.

The CIS fee does NOT include a copy of the IPC-A-610 standard - it is assumed that students will have access to the standard at their place of work.  The standard can be purchased separately – please refer to our online store or contact Teagan at This email address is being protected from spambots. You need JavaScript enabled to view it. to arrange.

 

All enquiries to This email address is being protected from spambots. You need JavaScript enabled to view it.

Event Information

Event Date 23 Jan 2025 8:45 am
Event End Date 24 Jan 2025 4:30 pm
Cut Off Date 17 Jan 2025
Capacity 8
Individual Price $1,170.00
Location Training Centre Adelaide
Categories IPC-A-610

IPC-A-610 Training Course Information

The IPC-A-620 Training and Certification course is conducted over three days and includes the following topics:

  • Purpose and application of IPC-A-610
  • Hardware installation
  • Soldering criteria, including lead free connections
  • Soldered requirements for connecting to terminals
  • Soldered connection requirements for plated-through holes
  • Surface mounting criteria for chip components, leadless and leaded chip carriers
  • Swaged hardware, and heatsink requirements of mechanical assemblies
  • Component mounting criteria for DIPS, socket pins, and card edge connectors
  • Jumper wire assembly requirements
  • Solder fillet dimensional criteria for all major SMT component groups
  • Soldering anomalies such as tombstoning, dewetting, voiding, etc
  • Criteria for component damage, laminate conditions, cleaning and coating