IPC-A-610 Recertification (CIS) 23-JAN-2025
THIS RECERTIFICATION COURSE IS INTENDED FOR INDIVIDUALS WITH A CURRENT CERTIFICATION
*To recertify, you must be within the 6-month recertification window (6 months prior to expiry of current certificate) as per the IPC Policies and Procedures. See here: Certifications in Electronics Manufacturing | IPC International
*Please include your current IPC Certificate Number in your booking.
TOPICS COVERED IN THE IPC-A-610 CERTIFICATION COURSE (REVISION J):
Module 1 (Required)
General, Applicable Documents and Handling
Module 2 (Optional)
Soldering and High Voltage
Module 3 (Optional)
Component Damage & Printed Boards and Assemblies
Module 4* (Optional)
Terminal Connections
Module 5** (Optional)
Through-Hole Technology and Jumper Wires
Module 6** (Optional)
Surface Mount Assemblies and Jumper Wires
Module 7 (Optional)
Hardware
*Module 4 requires the completion of Module 2 first
** Modules 5 and 6 Require the completion of Modules 2 & 3 first
FEES:
IPC-A-610 Recertification Course Fee: Book online or contact the SMCBA for pricing.
SMCBA Members receive a discount.
PLEASE NOTE:
The fee for the IPC-A-610 Recertification course includes all materials for the course, refreshments and catering each day.
The CIS fee does NOT include a copy of the IPC-A-610 standard - it is assumed that students will have access to the standard at their place of work. The standard can be purchased separately – please refer to our online store or contact Teagan at
All enquiries to
Event Information
Event Date | 23 Jan 2025 8:45 am |
Event End Date | 24 Jan 2025 4:30 pm |
Cut Off Date | 17 Jan 2025 |
Capacity | 8 |
Individual Price | $1,170.00 |
Location | Training Centre Adelaide |
Categories | IPC-A-610 |
IPC-A-610 Training Course Information
The IPC-A-620 Training and Certification course is conducted over three days and includes the following topics:
- Purpose and application of IPC-A-610
- Hardware installation
- Soldering criteria, including lead free connections
- Soldered requirements for connecting to terminals
- Soldered connection requirements for plated-through holes
- Surface mounting criteria for chip components, leadless and leaded chip carriers
- Swaged hardware, and heatsink requirements of mechanical assemblies
- Component mounting criteria for DIPS, socket pins, and card edge connectors
- Jumper wire assembly requirements
- Solder fillet dimensional criteria for all major SMT component groups
- Soldering anomalies such as tombstoning, dewetting, voiding, etc
- Criteria for component damage, laminate conditions, cleaning and coating