Jasbir Bath
Bath Consultantcy LLC
Jasbir has over thirty years’ experience in research, design, development and implementation in the areas of soldering, surface mount and packaging technologies. He brings experience from roles at Koki Solder America, Inc., Flextronics International / Solectron Corporation and the ITRI (International Tin Research Institute). He has been involved with the INEMI Board Assembly Roadmap for over 12 years. He is the editor of 5 books on electronics manufacturing and reliability and conducts audits to IPC standards at electronic manufacturing sites.
The iNEMI Board Assembly Roadmap – A Ten Year Look Ahead to Tomorrows Challenges
An in-depth review of the INEMI (InterNational Electronics Manufacturing Initiative) board assembly chapter roadmap published last year. Jasbir will detail some of the challenges the electronics assembly industry will face in the next 10 years and discuss potential solutions to those challenges. Challenges discussed will include component developments including larger BGAs and CPU sockets, press-fit technology, SMT printing and reflow and rework/repair of electronic assemblies and the developments needed for the assembly materials used.
The SMCBA is a Licenced IPC Training Centre for the IPC programs - 