Dave Hillman
Hillman Electronic Assembly Solutions LLC
David D. Hillman was a Metallurgical Engineer in the Advanced Operations Engineering Department of Rockwell Collins/Collins Aerospace in Cedar Rapids, Iowa. Mr. Hillman graduated from Iowa State University with a B.S. (1984) and M.S. (2001) in Material Science & Engineering. In his Collins assignment he served as an Expert on Call to manufacturing on material and processing problems. He served as a Subject Matter Expert (SME) for the Lead-free Manhattan Project in 2009. He has published 250+ technical papers. Mr. Hillman was named a Rockwell Collins Fellow in 2016. He was named an IPC Raymond E. Prichard Hall of Fame award recipient in 2018. He served as the Chairman of the IPC J-STD-002 Solderability committee for 20 years. Mr. Hillman served as a Metallurgical Engineer at the Convair Division of General Dynamics with responsibility in material testing and failure analysis prior to joining Rockwell. Mr. Hillman retired from Collins Aerospace in 2022 and currently doing selective consulting as Hillman Electronic Assembly Solutions LLC. He is a member of the American Society for Metals (ASM), the Minerals, Metals & Materials Society (TMS), and Surface Mount Technology Association (SMTA) and the Institute for Interconnecting and Packaging of Electronic Circuits (IPC).
Bottom Terminated Components (BTCs) Technology: History, Design, Manufacturing Implementation and Solder Joint Reliability
This workshop includes the evolution and introduction of BTC components into the electronics industry, component package design attributes, and manufacturing aspects (land patterns, solder paste stenciling thru cleaning). Solder joint reliability, for both tin/lead and Pbfree soldering processes, is covered in terms of thermal cycling, vibration and drop shock under IPC Class 2/3 High Performance product testing. The impact of voids in terms of BTC solder joint integrity and thermal attributes will be specifically covered in depth.
TOPICS WILL INCLUDE:
• Background
• BTC Packages
• LGA Packages
• IPC-7093 Specification
• Pad Design Impacts/Influences•
• Manufacturing Implementation
• Solder Joint Voids
• Solder Joint Integrity
• Thermal Management
• Stenciling/Reflow/Cleaning
• Solder Joint Reliability
• Thermal Cycle
• Drop Shock
• Vibration
• Mechanical Shock
The SMCBA is a Licenced IPC Training Centre for the IPC programs - 