Dave Hillman
Hillman Electronic Assembly Solutions LLC
David D. Hillman was a Metallurgical Engineer in the Advanced Operations Engineering Department of Rockwell Collins/Collins Aerospace in Cedar Rapids, Iowa. Mr. Hillman graduated from Iowa State University with a B.S. (1984) and M.S. (2001) in Material Science & Engineering. In his Collins assignment he served as an Expert on Call to manufacturing on material and processing problems. He served as a Subject Matter Expert (SME) for the Lead-free Manhattan Project in 2009. He has published 250+ technical papers. Mr. Hillman was named a Rockwell Collins Fellow in 2016. He was named an IPC Raymond E. Prichard Hall of Fame award recipient in 2018. He served as the Chairman of the IPC JSTD-002 Solderability committee for 20 years. Mr. Hillman served as a Metallurgical Engineer at the Convair Division of General Dynamics with responsibility in material testing and failure analysis prior to joining Rockwell. Mr. Hillman retired from Collins Aerospace in 2022 and currently doing selective consulting as Hillman Electronic Assembly Solutions LLC. He is a member of the American Society for Metals (ASM), the Minerals, Metals & Materials Society (TMS), and Surface Mount Technology Association (SMTA) and the Institute for Interconnecting and Packaging of Electronic Circuits (IPC).
Pbfree Solder Alloys: Generation 1 thru Generation 3 Evolution
This workshop covers the iNEMI Pbfree Solder alloy program results produced over the last 20 years. It includes the three distinct generations of Pbfree solder alloy evolution with emphasis on the current Generation 3 solder alloys. The current industry focus on the use of bismuth, indium and antimony elemental additions and their influence on the solder alloy reliability will be covered.
The SMCBA is a Licenced IPC Training Centre for the IPC programs - 