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August 30 & 31, 2018 - Two Day Workshop

Venue:  Sudima Auckland Airport Hotel

Address:  18 Airpark Drive, Airport Oaks, Auckland

The Presenter:

Susy Webb

Senior PCB Designer, Design Science (USA)

Susy Webb is a senior PCB designer with 37 years of experience. Her career includes experience in coastal and oceanographic oil exploration and monitoring equipment, point-to-point microwave network systems, and CPCI and ATX computer motherboards. She has set up company standards, documentation, procedures, and library conventions for several companies. Webb is a regular speaker at the PCB, IPC and international Design conferences, and consults for individual companies as well. Her presentations discuss practical implementation of complex engineering concepts into board layout, and methods to improve the overall design and flow of printed circuit boards. She is CID certified and a former writer/columnist for Printed Circuit Design and Fab magazine. Webb is also an active member of the IPC Designer’s Council Executive Board and Education Committee, and is a member and past president of the Houston Chapter of the IPC Designer’s Council.

1.  Designing BEYOND Simulation –

There’s so Much More You Can Do!

Simulation is a great tool…. But it’s not the only tool for predicting a high quality board that has low noise, good signal integrity, is manufacturable, and performs well while in service. In this presentation, we will show how the designer’s knowledge of basic electronics and physics can also be used to understand how the signals will actually flow and return within the board structure. We will discuss how to control that high frequency energy with spacing, planes, stackup, and layer paired routing. Even if signals are not designated as impedance controlled signals, controlling their impedance throughout helps to control reflections, crosstalk, false triggering, and EMI (noise). Parts can be placed and routing can be done in a manner that will also help to control EMI. The power and ground distribution can be carefully planned with capacitor and plane placement so that the design will be able to handle the power needs of the parts while in operation. We will go over all these things to suggest how to get the best possible results from the board layout.

2. Building a Bridge from Design to Manufacturing

There is so much more to board design than placing parts and connecting the signals electrically! Those who design the board can make a HUGE impact on the ease of fabrication and assembly just by the practices they put into place as they work. Knowledge and use of standard (best) practices, whether IPC or company standards, ensures that what is sent to the manufacturer will be understood and incorporated with minimal questions, and that can be a real time and cost savings.

In this class, we will talk about good practices for building footprints, how parts might be placed for manufacturability, routing practices that are helpful, trace widths and spacings that are producible, a stackup structure that can realistically get the impedance and return needed, and documentation for the manufacturer that is complete and understandable. This presentation is not about how to build a board, but rather about the practical things the board engineer can do to help make fabrication and assembly easier and therefore increase yields and lower the cost for all.

3. The Complexities of Designing with Fine Pitch BGAs

Designing with BGAs is much more complex than in the past! The ball pitches are going down and the total pin counts and package sizes are going up, making everything more demanding. With those changes, the signal integrity and EMI issues become more profound, the fanout and routing are much more challenging, and the power connections more difficult. Adding to that are the manufacturing concerns unique to these parts that have surfaced from small pad openings and the ways we make the connections in larger BGAs that don’t work as well in fine pitched parts. In this presentation, we will discuss all of those things and more, including placement and stackups for components and caps, gridded and non-gridded patterns for parts and routing, and both through hole and microvia fanout possibilities. This class has lots of illustrations and examples!

4. Part Placement Choices and Consequences

There are many ways to place parts on any board, but clearly some ways work better for physics, electrical, and mechanical purposes. If a new board works electrically but won’t interface properly with the rest of its system, it may require costly and time consuming re-design and re-testing. Designers must understand the board, electrical and system needs, as well as typical placement and routing guidelines and the consequences of not adhering to them. When they understand the reasoning behind these things, and the affects they have on one another, designers will intuitively know how to make good decisions for their own board designs, and so avoid problems. In this presentation, we will discuss choosing effective parts, approximate order of overall placement, placement to set up routing and channels, board and system consequences, and more.

FEE:

SMCBA MEMBERS:  AU$900

NON MEMBERS:  AU$1200

Design Workshop in Auckland

Aug 30, 2018 - Aug 31, 2018
Location: Sudima Auckland Airport
Full: $1200.00 excl GST, Member Price: $900.00 excl GST

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