Jasbir Bath
Bath Consultancy LLC
Jasbir has over 25 years of experience in research, design, development and implementation in the areas of soldering, surface mount and packaging technologies. He began his engineering career as a technical officer at the International Tin Research Institute (ITRI) in the UK. In 1998 he joined Flex/Solectron as a corporate lead engineer specialising in soldering materials, processes and components. In 2008 he formed his own company providing process consulting and training services to the electronics manufacturing industry. He is a Support Advisory Engineer with Koki Solder Americas, Inc.. He has been involved with the INEMI Board Assembly Roadmap for over 10 years and is currently the Vice President of Technical Programs for the SMTA (Surface Mount Technology Association) Silicon Valley (San Jose) chapter. He is the recipient of the SMTA Excellence in Leadership Award and is the editor of 5 books on lead-free manufacturing and reliability. He has BS and MS degrees in Materials Science from the University of Manchester, England.
SMT Process Setup - Wednesday May 10:
Main Topics:
- Printing Pressure, Speed and Stencil Release Rate for Solder Paste Printing
- Stencil Types
- Solder paste material types
- Stencil design
- Solder Paste Inspection (SPI)
- Reflow ovens/ types
- Reflow Profiling/ Set-up
- Reflow Preheat/Soak temperature and time
- Reflow temperature and time
- Reflow Ramp up and cooling down rates
- Reflow atmosphere
- AOI (Automated Optical Inspection)
- X-ray
- ICT (In Circuit Test)