September 11 and 12, 2019 - Two Day Workshop
Improving Manufacturing Yield and Reliability
Date: Wednesday Sept 11 and Thursday Sept 12
Time: 8.00 am registration for 8.30 am start Finish 5.00 pm approx on Day 1 and 4.00 pm approx on Day 2
REGISTRATION CODE: IMR
This two day workshop will cover the challenges in electronics manufacturing to improve manufacturing yield and reliability with the variety of components being assembled on the board.
Part 1: Design for Manufacturability and Reliability
Discussion on the critical elements to achieve successful manufacturing and their interactions.
Part 2: Board pad and stencil design, soldering materials, board and component surface finishes and their affect on manufacturing yield and reliability
- board pad design and stencil aperture design for a variety of components including chip components, BGA/CSP components, BTC/MLF/QFN/ LGA components and lead-frame components
- the affects on manufacturing yield and board level reliability with reference to various IPC and related industry standards and evaluations done in industry.
- soldering materials, board and component surface finishes and their influence on process yield and reliability.
Mr Bath will review these interactions in detail and discuss potential solutions together with assembly guidelines and best practices for improved manufacturing yield and reliability.
Part 3: Backward and forward compatibility assembly and reliability and low silver and higher reliability lead-free solder alloys used in electronics manufacturing
Mr Bath will discuss backward compatibility and forward compatibility assembly and reliability and lead-free low silver solder alloys and emerging trends for high reliability lead-free alloys.
- Backward Compatibility (Tin-lead Paste assembled with lead-free BGA/CSP components), Lead-free Sn3Ag0.5Cu paste assembled with low silver BGA/CSP components and the general area of Low silver and high reliability lead-free solders.
- These topics will be covered in terms of:
- Process Challenges
- Reflow Behaviour
- Assembly Guidelines
- With the introduction of lead-free electronics manufacturing, many new issues arose including mixing of tin-lead paste with lead-free components including BGAs and the use of lead-free high silver containing solder paste with low silver lead-free BGA components.
- Mr Bath will review these interactions in detail from a process/reflow, microstructure and reliability perspective and discuss potential solutions together with assembly guidelines and best practices.
- He will also review low silver lead-free solder alloys used in manufacturing and emerging trends in the assessment and use of higher reliability lead-free solder alloys compared with Sn3Ag0.5Cu (SAC305).
Part 4: Printing and Its Affect on Manufacturing Yield
The printing process is one of the most critical processes to optimize and improve manufacturing yield. The course will review stencil aperture requirements of a variety of components, stencil thicknesses, types of stencils, the printing process, printing Design of Experiments (DOEs), and solder paste use and selection in order to understand the key factors which need to be optimized for successful printing.
- Printing Processes and Stencil Types/ Guidelines
- Common Printing Problems
- Solder paste material types
- Stencil design
- Print DOEs
- Component Trends
- Printing Reliability (new to this workshop)
- Case studies for optimizing print volumes to reduce defects such as Head-in-Pillow
Part 5: Reflow, Wave and Rework Soldering Process Optimization in Electronics Manufacturing
The soldering processes for reflow, wave and rework soldering are essential processes to optimize and improve yield and reliability. The course will review reflow, wave and rework soldering materials and processes with a focus on optimization of preheat and soldering temperatures and times.
It will cover typical soldering issues which can occur during reflow, wave and rework with a review of profiles which can be used to help address them with a review of board and component temperature ratings.
It will discuss interactions with different board and components having different surface finishes in relation to microstructure and reliability for these processes and factors which should be optimized for improved results.
- Reflow, Wave and Rework Soldering materials and processes
- Common Reflow, Wave and Rework Problems
- Component and Board Temperature Ratings and Component and Board Surface Finishes
- Selective Wave Soldering (new to this workshop)
- Microstructure and Reliability
- Case studies to optimize soldering processes
Part 6: Other DFR Consideratons
- Solder Joint Volume
- Board and Component Finishes
- Reliability Tests in Industry and Case Studies
Q&A: Attendees are invited to raise questions regarding manufacturing and reliability issues they have encountered.
Bath Consultancy LLC
Jasbir has over 20 years of experience in research, design, development and implementation in the areas of soldering, surface mount and packaging technologies. He has extensive knowledge of soldering tecnologies and in 2012 was appointed as principal engineer within IPC's assembly technology area.
He began his engineering career as a technical office at the International Tin Research Institute (ITRI) in the UK. In 1998 he joined Flextronics/Solectron as a lead engineer specialising in soldering materials, processes and components. In 2008 he formed his own company providing process consulting and training services to he electronics manufacturing industry.
Jasbir has contributed to four books on lead-free manufacturing and has worked closely with IPC's Solder Products Value Council (SPVC) to develop process and reliability data and he served on an IPC Blue Ribbon Committee to develop the IPC Lead-free Process Certification Site Audit Program. He holds BS and MS degrees in materials science from the University of Manchester England.