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September 6, 2018 - Half Day Workshop

Reflow, Wave and Rework Soldering Process Optimization in Electronics Manufacturing  

Date: Thursday September 6 2018

Time: 1.45 pm registration for 2.00 pm start   Finish 5.30 pm approx

REGISTRATION CODE:  JB3

The soldering processes for reflow, wave and rework soldering are essential processes to optimize to improve yield and reliability. The course will review reflow, wave and rework soldering materials and processes with a focus on optimization of preheat and soldering temperatures and times.

It will cover typical soldering issues which can occur during reflow, wave and rework with a review of profiles which can be used to help address them with a review of board and component temperature ratings.

It will discuss interactions with different board and components having different surface finishes in relation to microstructure and reliability for these processes and factors which should be optimized for improved results.

Topics Covered

  • Reflow, Wave and Rework Soldering materials and processes
  • Common Reflow, Wave and Rework Problems
  • Component and Board Temperature Ratings and Component and Board Surface Finishes
  • Microstructure and Reliability
  • Case studies to optimize soldering processes

The Presenter:

Jasbir Bath

Bath Consultancy LLC

Jasbir has over 20 years of experience in research, design, development and implementation in the areas of soldering, surface mount and packaging technologies.  He has extensive knowledge of soldering tecnologies and in 2012 was appointed as principal engineer within IPC's assembly technology area. 

He began his engineering career as a technical office at the International Tin Research Institute (ITRI) in the UK.  In 1998 he joined Flextronics/Solectron as a lead engineer specialising in soldering materials, processes and components.  In 2008 he formed his own company providing process consulting and training services to he electronics manufacturing industry.

Jasbir has contributed to four books on lead-free manufacturing and has worked closely with IPC's Solder Products Value Council (SPVC) to develop process and reliability data and he served on an IPC Blue Ribbon Committee to develop the IPC Lead-free Process Certification Site Audit Program.  He holds BS and MS degrees in materials science from the University of Manchester England.