September 6, 2018 - Half Day Workshop
Printing and Its Affect on Manufacturing Yield
Date: Thursday September 6 2018
Time: 8.00 am registration for 8.30 am start Finish 12.30 pm
REGISTRATION CODE: JB2
The printing process is one of the most critical processes to optimize to improve manufacturing yield. The course will review stencil aperture requirements of a variety of components, stencil thicknesses, types of stencils, the printing process, printing Design of Experiments (DOEs), and solder paste use and selection in order to understand the key factors which need to be optimized for successful printing.
- Printing Processes and Stencil Types/ Guidelines
- Common Printing Problems
- Solder paste material types
- Stencil design
- Print DOEs
- Component Trends
- Case studies for optimizing print volumes to reduce defects such as Head-in-Pillow
Bath Consultancy LLC
Jasbir has over 20 years of experience in research, design, development and implementation in the areas of soldering, surface mount and packaging technologies. He has extensive knowledge of soldering tecnologies and in 2012 was appointed as principal engineer within IPC's assembly technology area.
He began his engineering career as a technical office at the International Tin Research Institute (ITRI) in the UK. In 1998 he joined Flextronics/Solectron as a lead engineer specialising in soldering materials, processes and components. In 2008 he formed his own company providing process consulting and training services to he electronics manufacturing industry.
Jasbir has contributed to four books on lead-free manufacturing and has worked closely with IPC's Solder Products Value Council (SPVC) to develop process and reliability data and he served on an IPC Blue Ribbon Committee to develop the IPC Lead-free Process Certification Site Audit Program. He holds BS and MS degrees in materials science from the University of Manchester England.