September 6, 2018 - Half Day Workshop
The Complexities of Designing with Fine Pitch BGAs
Date: Thursday September 6 2018
Time: 8.00 am registration for 8.30 am start Finish 12.30 pm
REGISTRATION CODE: SW3
Designing with BGAs is much more complex than in the past! The ball pitches are going down and the total pin counts and package sizes are going up, making everything more demanding. With those changes, the signal integrity and EMI issues become more profound, the fanout and routing are much more challenging, and the power connections more difficult. Adding to that are the manufacturing concerns unique to these parts that have surfaced from small pad openings and the ways we make the connections in larger BGAs that don’t work as well in fine pitched parts. In this presentation, we will discuss all of those things and more, including placement and stackups for components and caps, gridded and non-gridded patterns for parts and routing, and both through hole and microvia fanout possibilities. This class has lots of illustrations and examples!
Senior PCB Designer, Design Science (USA)
Susy Webb is a senior PCB designer with 37 years of experience. Her career includes experience in coastal and oceanographic oil exploration and monitoring equipment, point-to-point microwave network systems, and CPCI and ATX computer motherboards. She has set up company standards, documentation, procedures, and library conventions for several companies. Webb is a regular speaker at the PCB, IPC and international Design conferences, and consults for individual companies as well. Her presentations discuss practical implementation of complex engineering concepts into board layout, and methods to improve the overall design and flow of printed circuit boards. She is CID certified and a former writer/columnist for Printed Circuit Design and Fab magazine. Webb is also an active member of the IPC Designer’s Council Executive Board and Education Committee, and is a member and past president of the Houston Chapter of the IPC Designer’s Council.