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Wednesday September 6, 2017

CODE ESD:  ESD CONTROL FOR ELECTRONICS ASSEMBLY

Time: 9.15 am registration for 9.30 am start   Finish 11.30 am

REGISTRATION CODE:  ESD

Instructor:  Ken Galvin, Master IPC Trainer

As new generations of integrated circuits (ICs) become more sensitive to electrostatic discharge, ESD continues to be one of the most serious problems facing the electronics industry. Education is essential to prevent costly failures and expensive rework.

Now your electronics assembly operators can become recognized as “ESD Safe” by two major electronics associations. A joint collaboration between IPC, Association Connecting Electronics Industries, and the ESDA, Electrostatic Discharge Association has produced the most up-to-date, technically accurate ESD Control video training currently available to deal with the effects of shrinking geometries, increased performance requirements and lower operating voltages.

Developed by top industry experts, this educational video covers static electricity generation, triboelectric charging, ESD failure models and techniques to control ESD, including personal grounding for seated and standing operations, wrist straps, controlling static charges in the work area, and proper handling, packaging and transporting of ESD sensitive devices in accordance with the S20.20 ESDA Specification.

At the end of the training a test will be given and certificates issued to those attaining the required pass mark.

Cost:   SMCBA Members $120 plus GST        Non-Members $150 plus GST

 

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September 7, 2017 - Half day workshop with Phil Zarrow

The “Deadly Sins” of SMT Assembly

Date: Thursday September 7, 2017

Time: 8.30 am registration for 9.00 start   Finish 12.15 pm

REGISTRATION CODE:  PZ2

Everyone has heard of the “7 Deadly Sins” that will, supposedly, lead one to Hell. There are also the “Deadly Sins” of SMT - there are more than just 7 – and they can make your assembly process a “hell on earth”.

During the course of our assembly process audits and troubleshooting work, we tend to see trends in the types of errors and problems. In other words, a lot of people are making the same mistakes. The resulting process problems wreak havoc with an impact on assembly yields ranging from 5 to 20%. In addition to this direct cost, there is also additional financial impact with regard to time spent reworking and repairing, the on corrective action by QC, Engineering and Management, and, of course, “do-over”.

This workshop identifies the “deadly sins” of SMT assembly, both for Pb-free and “leaded” processes. Besides the symptoms and consequences of each type of error, root-cause, rectification and prevention techniques will be presented. Best Practices will be discussed for each of the key process steps. The workshop will, thus, provide the participant with an understanding of how to identify and correct the most common SMT assembly problems. It will include identification of vendor and source problems including components and materials as well as design related problems.  

Topics Covered:

  • Areas of General Process “Sins”Utilization of Process Feedback Data
  • Design for Manufacturability and Assembly
  • In-Process Inspection and AOI
  • Solder Paste Selection
  • MSD
  • Procedures and Documentation
  • Stencil Printing
  • Stencil Design
  • Stencil Cleaning
  • Component Placement and Feeders
  • Reflow Soldering
  • Parameters and Nitrogen
  • Wave Soldering
  • Inefficiency
  • Unbalanced lines
  • Excessive Downtime

Who Should Attend:
This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount or mixed technology assemblies.

The Presenter:

Phil Zarrow is the President and Principal Consultant for ITM Consulting and has been involved with PCB fabrication and assembly for more than thirty-five years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world. During his tenure as Director of Technology Development for GSS/Array Technology, he was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.

Mr. Zarrow formed ITM Consulting in 1993 and has helped countless companies in all aspects of PCB Design and Assembly. He is a popular speaker and workshop instructor. He has chaired and instructed numerous seminars and conferences in many countries. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books. He is co-author of the book, "SMT Glossary- Terms and Definitions" and holds two US Patents concerning PCB fabrication and assembly processes and audit methodologies.

Phil is a member of IPC, SME, IMAPS, a co-founder of ITM Incorporated, and is a past national level officer and national director of the Surface Mount Technology Association (SMTA). He was also Chairman of the Reflow Committee for SMEMA. He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders’ Award (2000). Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forefront"and “Better Manufacturing” columns. He is currently producer and co-host of IPC Update’s “Boardtalk” audio program.

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September 6, 2017

One Day Workshop: 

Flexible and Rigid Flex Circuits - Design, Assembly and Quality Assessment

Date: Wednesday September 6, 2017

Time: 8.30 am registration for 9.00 start   Finish 4.45 pm (approx.)

REGISTRATION CODE:  VS1

This full day program focuses on the implementation of design principles for flexible and rigid flex circuits, alternative fabrication methodologies and planning for assembly process efficiency. Information presented will include the selection criteria for base materials, general quality expectations, assessment of alternative fabrication methodologies and basic requirements for accommodating SMT-on-flex assembly processing. The material presented will detail specific requirements for the design of flexible printed circuit applications and its forms of component mounting and interconnecting structures. The instructor will also furnish practical flex circuit DfM benchmarks for ensuring end product quality, reliability and maximizing manufacturing efficiency.

Topics of discussion:

  1. Applications, standards and defining product use environments
  2. Designing flexible and rigid-flex circuits (IPC-2223)
  3. Flex circuit construction alternatives
  4. Flex and Rigid Flex circuit fabrication process variations
  5. SMT component selection and land pattern development
  6. Specifying base material, plating and coating
  7. Fabrication quality assessment (IPC-A-610 and IPC-6013)
  8. Assembly process implementation

Who Should Attend:

This tutorial has been developed to furnish the design professionals, systems engineers, assembly and test engineering specialists with a thorough understanding of the materials, fabrication process variations and preferred design practices for flexible and rigid-flex circuits. In addition, the requirements for automated SMT assembly will be defined and include detailed guidance regarding panel planning and accommodating current assembly process variations.

The Presenter:

Vern Solberg is a technical consultant specializing in SMT and microelectronics design and manufacturing technology. He has served the electronics industry for more than thirty years in areas related to both commercial and aerospace electronic product development and is active as an author and educator. Mr Solberg holds several patents for IC packaging innovations including the multiple die and folded-flex 3D package technology and is the author of Design Guidelines for Surface Mount and Fine-Pitch Technology a McGraw-Hill publication.  Mr Solberg's last visit to Australia was received with great acclaim by all who attended and we are delighted he is able to again participate at the SMCBA conference.

Mr. Solberg has been involved with the training of both students and faculty members at the University of Wisconsin, School of Engineering in Milwaukee and Kansas State Universities Microelectronic Laboratory in Salina. He also participates in and supports several industry organizations including SMTA, IEEE, IMAPS and IPC developing electronic industry related standards. Vern is also a member of the IPC organizations Ambassadors Council as well as a Certified IPC Trainer for IPC-A-600 and IPC-A-610.

Current IPC standards development activity-

  • Chairman- IPC-7094, ‘Design and Assembly Process Implementation for Flip Chip and Die Size Components’
  • Co-chair- IPC-7093, ‘Design and Assembly Process Implementation for Bottom Terminal Components (SON and QFN)’.
  • Co-chair- IPC-7092, ‘Design and Assembly Process Implementation for Embedded Components’.
  • Co-chair- IPC-7091, ‘Design and Assembly Process Implementation for 3D Semiconductor Package Technology’

 

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September 7, 2017 - Half day workshop

Implementing Advanced “Leading Edge” and “Bleeding Edge” SMT Component Technology

Date: Thursday September 7, 2017

Time: 1.15 pm registration for 1.30 pm start   Finish 4.30 pm approx

REGISTRATION CODE:  PZ3

The circuit board assembler is constantly challenged by components that seem to defy logic and manufacturability. Passives such as 0201s and 01005s, while bringing happiness to the designer with regard to layout densities are the bane of the assembler. IC packaging also has adhered to the mantra of “smaller, faster” taunting the assembler with land-grid arrays (or no lead packages) and high-density CSPs and Flip-chips. Yet, manufacturing PCBAs with these “bleeding edge” components is not insurmountable, (though not for the weak of heart).

This workshop discusses practical approaches in dealing with the most challenging of component packages. Optimizing the SMT assembly process, as it pertains to very small and high-density components will be covered. The impact of lead-free and RoHS compliance will, of course, also be discussed. Case studies based upon the instructor’s experience will be presented.

Topics Covered:

Bottom Terminated Components (BTCs)

  • QFN, SON, LGA, etc
  • BTC Advantages
  • BTC Challenges
  • Center Pad Issues
  • Warping
  • Reliability Issues
  • Voiding and “Avoiding the Void”
  • Stencil and Window Pane Considerations
  • PCB approaches
  • Solder approaches
  • Reflow considerations

Ultra-fine Pitch ICs

  • 0.5, 0.4 and 0.3mm Challenges
  • Ultra-fine Pitch Components
  • Micro-passives
  • 0201, 01005 and 008004 Implementation Challenges
  • Design issues
  • PCB Fabrication issues
  • Assembly Process Issues
  • Printing
  • Placement
  • Reflow
  • Rework

Who Should Attend:
This course is intended for Manufacturing, Process, Design, Test and Quality Engineering personnel as well as Management who are involved in the production of surface mount assemblies.

 

The Presenter:

Phil Zarrow is the President and Principal Consultant for ITM Consulting and has been involved with PCB fabrication and assembly for more than thirty-five years. His expertise includes the manufacture of equipment for circuit board fabrication and assembly of through-hole and surface mount technologies. In addition to his background in automated assembly and cleaning, Mr. Zarrow is recognized for his expertise in surface mount reflow soldering technology and in the design and implementation of SMT placement equipment and reflow soldering systems. Having held key technical and management positions with Vitronics Corporation, Excellon-Micronetics and Universal Instruments Corporation, he has extensive hands-on experience with set-up and troubleshooting through-hole and SMT processes throughout the world. During his tenure as Director of Technology Development for GSS/Array Technology, he was responsible for specifying and setting up medium- and high-speed assembly lines, as well as investigating and implementing emerging and leading-edge technologies, equipment and processes.

Mr. Zarrow formed ITM Consulting in 1993 and has helped countless companies in all aspects of PCB Design and Assembly. He is a popular speaker and workshop instructor. He has chaired and instructed numerous seminars and conferences in many countries. He has published many technical papers and magazine articles as well as contributed a number of chapters to industry books. He is co-author of the book, "SMT Glossary- Terms and Definitions" and holds two US Patents concerning PCB fabrication and assembly processes and audit methodologies.

Phil is a member of IPC, SME, IMAPS, a co-founder of ITM Incorporated, and is a past national level officer and national director of the Surface Mount Technology Association (SMTA). He was also Chairman of the Reflow Committee for SMEMA. He was the recipient of the SMTA's Member of Distinction Award (1995) and Founders’ Award (2000). Mr. Zarrow has served on the Editorial Advisory Board for Circuits Assembly Magazine and won awards for his writings "On the Forefront"and “Better Manufacturing” columns. He is currently producer and co-host of IPC Update’s “Boardtalk” audio program.

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September 7, 2017 - Half day workshop

Embedding Passive and Active Components: PCB Design and Assembly Process Fundamentals

Date: Thursday September 7, 2017

Time: 8.30 am registration for 9.00 start   Finish 12.15 pm

REGISTRATION CODE:  VS2

Both uncased active and passive component elements are candidates for embedding but the decision to embed components within the multilayer circuit structure must be made early in the design process. Although the printed circuit has traditionally served as the platform for mounting and interconnecting active and passive components on the outer surfaces, companies attempting to improve functionality and minimize space are now considering embedding a broad range of components within the circuit structure.

Some components are easy candidates for integrating into the substrate while others may involve more complex processes and will be difficult to rationalize. Although a majority of the discrete passive and active devices may remain mounted on the outer surfaces of the multi-layer board, embedding one or more silicon based semiconductor elements within the inner layers of the structure will enable greater utilization of the circuit boards outer surfaces. Benefits can include improved performance, For example, by embedding the semiconductor on an inner layer of the circuit directly in line with a related semiconductor package mounted on the outer surface, the conductor interface can be minimized. The close coupling of semiconductor elements significantly reduces inductance and contributes to increasing signal speed.

Course objectives-

This course was developed to better enable the product designer and manufacturing specialist to have a clear understanding of the principles for embedding components in an organic multilayer circuit board structure. The tutorial will include design guidelines, material selection and termination methodology for embedding active and passive (resistor, capacitor, inductor and discrete transistor) elements. Several process variations for embedding and interconnecting thinned semiconductor elements within the multi-layer PCB will be illustrated with examples of both core type and coreless substrate structures.

Who Should Attend:

The material has been developed specifically for PCB Designers, Design Engineers and those responsible for electronic product development, assembly processing and manufacturing efficiency. This would include manufacturing and test engineering specialists for the OEM, ODM and EMS providers.

The Presenter:

Vern Solberg is a technical consultant specializing in SMT and microelectronics design and manufacturing technology. He has served the electronics industry for more than thirty years in areas related to both commercial and aerospace electronic product development and is active as an author and educator. Mr Solberg holds several patents for IC packaging innovations including the multiple die and folded-flex 3D package technology and is the author of Design Guidelines for Surface Mount and Fine-Pitch Technology a McGraw-Hill publication.  Mr Solberg's last visit to Australia was received with great acclaim by all who attended and we are delighted he is able to again participate at the SMCBA conference.

Mr. Solberg has been involved with the training of both students and faculty members at the University of Wisconsin, School of Engineering in Milwaukee and Kansas State Universities Microelectronic Laboratory in Salina. He also participates in and supports several industry organizations including SMTA, IEEE, IMAPS and IPC developing electronic industry related standards. Vern is also a member of the IPC organizations Ambassadors Council as well as a Certified IPC Trainer for IPC-A-600 and IPC-A-610.

Current IPC standards development activity-

  • Chairman- IPC-7094, ‘Design and Assembly Process Implementation for Flip Chip and Die Size Components’
  • Co-chair- IPC-7093, ‘Design and Assembly Process Implementation for Bottom Terminal Components (SON and QFN)’.
  • Co-chair- IPC-7092, ‘Design and Assembly Process Implementation for Embedded Components’.
  • Co-chair- IPC-7091, ‘Design and Assembly Process Implementation for 3D Semiconductor Package Technology’